"15th Five-Year Plan" for the Electronic Information Manufacturing Industry Released: Smart Sensors Designated as a Key Priority

On 9 month 15, the Ministry of Industry and Information Technology and the National Development and Reform Commission jointly issued the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry" (hereinafter referred to as the "Plan"). Aimed at further enhancing China's competitiveness in the electronic information manufacturing sector, this plan serves as a key development guide for the industry over the next 5 years.

During the 14th Five-Year Plan period, China's electronic information manufacturing industry ranked first among all industrial sectors for 13 consecutive years, achieving technological breakthroughs in multiple areas. The plan aims to have revenue from large-scale enterprises exceed 30 trillion yuan by 2030, and outlines 17 key tasks and 9 special initiatives across four focus areas: strengthening industrial foundational capabilities, enhancing competitiveness of electronic equipment and systems, cultivating new growth points for industry development, and improving sustainable development capacity.

Key Task 3: Accelerate innovation and application of intelligent sensors

The "Plan" lists "Accelerating the innovation and application of smart sensors" as Task 3, proposing: enhance process capabilities for smart sensors such as MEMS, support R&D on sensor reliability technologies; establish a full-process quality control mechanism covering design, manufacturing, and packaging/testing to improve product stability and consistency; drive mainstream smart sensor products toward high-end segments, boost system-level supply capacity and application capabilities, strengthen market competitiveness for high-end products, and promote integrated applications of smart sensors in key industries and scenarios.

Column 1: Upgrading to High-End Electronic Components and Materials

Under the task of promoting high-end development of electronic components and materials, the Plan proposes to support circuit-type, connection-type, electromechanical-type, sensor-type, and functional material-type electronic components toward high-frequency/high-speed, high integration, and high reliability capabilities. This aims to meet demand in key areas such as artificial intelligence, next-generation information and communications, aerospace, and next-generation intelligent terminals, while enhancing the quality stability, reliability, and consistency of electronic components and materials.

Column 1 highlights sensor components, focusing on: miniaturized, low-power, integrated, and high-sensitivity sensing elements; advanced sensors for temperature, gas, displacement, speed, optoelectronics, and biochemistry; and miniaturized, intelligent electroacoustic devices.

Column 3: Optical Sensing in Photon Key Technologies and Product R&D

Under the task of "Strengthening the Foundation of the Photonics Industry," the Plan calls for enhancing the supply of light generation, processing, and sensing capabilities, integrated photonic chips, and micro-nano optical components. It also prioritizes R&D and industrialization of optical transceiver modules and engines, optical processing modules, LiDAR systems, gyroscopes, and supporting electronic chip devices. Column 3 highlights key areas in optical sensing, including single-photon detectors, fiber-optic sensors, infrared/ultraviolet and terahertz detectors, high-bandwidth detectors, as well as micro-nano optical structured surface elements and high-performance photonic waveguide devices.

Sensing in Consumer Electronics, Energy Electronics, and AI Hardware

In the consumer electronics sector (Column 5), focus areas include multimodal perception and interaction, spatial agents, precision sensors, and flexible electronic devices for key products such as virtual reality and wearable technology. In the energy electronics sector (Column 6), development of intelligent sensors and related chips is emphasized in power electronics. For the AI hardware foundation (Column 8), research priorities include high-precision intelligent sensing and multimodal fusion algorithms covering vision, hearing, touch, motion, and positioning, alongside perception and decision-making technologies for environment modeling and behavior planning.

Industry Electronics: Key Focus Areas Including Urban Sensing, Automotive Electronics, and Medical Electronics

Under the task "Accelerating the Integration of Electronic Digital Intelligence Technology Innovation in Industries" (Column 9), the Plan proposes: - **Urban Sensing**: Develop advanced ubiquitous intelligent sensing terminals and 5G lightweight (5G RedCap) communication devices. - **Automotive Electronics**: Focus on automotive-grade components, in-vehicle intelligent computing platforms, and vehicle-road collaboration terminals. - **Medical Electronics**: Prioritize specialized chips for high-end diagnostic and treatment equipment, sensors, and smart portable monitoring terminals; break through bottlenecks such as biosensing technologies. - **Aviation Electronics**: Support R&D and breakthroughs in high-reliability sensors, processors, encoders, and related products. - **Aerospace Electronics**: Overcome core technologies including radiation-hardened chips and devices, and high-precision navigation systems. - **Marine Electronics**: Key breakthroughs in intelligent marine environmental sensing and underwater high-precision communication and navigation technologies.

This content is compiled from public information in the "15th Five-Year Plan for the Development of the Electronic Information Manufacturing Industry," jointly issued by the Ministry of Industry and Information Technology and the National Development and Reform Commission, for industry exchange and reference purposes.